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<p><a href="https://www.pcbccl.com/copper-clad-laminate" rel="noopener noreferrer" target="_blank">Copper clad laminate</a> (CCL) is a raw material for the electronics industry. The structure of the copper clad laminate includes the substrate, copper foil, and adhesive for the copper clad laminate. It is a product made of wood pulp paper or glass fiber cloth as reinforcing materials, impregnated with resin, covered with copper foil on one or both sides, and hot pressed.</p><p><br></p><p>1. Substrate: Insulating laminate composed of polymer synthetic resin and reinforcing material can be used as the substrate of copper clad laminate. There are many types of synthetic resins, commonly used are phenolic resin, epoxy resin, polytetrafluoroethylene and so on. Reinforcement materials generally have two types: paper and cloth, which determine the mechanical properties of the substrate, such as solder dip resistance and bending strength.</p><p><br></p><p>2. Copper foil: It is the key material for the manufacture of copper-clad plates, which must have high conductivity and good weldability. It is required that the surface of the copper foil shall not have scratches, blisters and wrinkles, the metal purity shall not be less than 99.8%, and the thickness error shall not exceed ±5um. According to ministerial standards, the nominal series of copper foil thickness are 18, 25, 35, 70 and 105um. my country is currently gradually promoting the use of 35um thick copper foil. The thinner the copper foil, the easier it is to etch and drill, which is especially suitable for manufacturing high-density printed boards with complex circuits.</p><p><br></p><p>3. Copper Clad Laminate Adhesive: Adhesive is an important factor in whether the copper foil can be firmly covered on the substrate. The peel strength of the copper clad laminate mainly depends on the performance of the adhesive.</p>
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