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<p>The choice of <a href="https://www.atechpcb.com/microwave-rf-pcb" target="_blank">microwave</a> <a href="https://www.atechpcb.com/microwave-rf-pcb" rel="noopener noreferrer" target="_blank"><a href="https://www.atechpcb.com/microwave-rf-pcb" target="_blank">RF PCB</a></a> laminate should first consider its dielectric properties, but it must also consider the type and thickness of the surface copper foil, environmental adaptability, process-ability factors and cost issues.</p><p><br></p><p><strong>Type and thickness of copper foil</strong></p><p><br></p><p>Currently, the most commonly used copper foil thickness is 35μm and 18μm. Thinner copper foil is easier to achieve high image accuracy, so high-precision microwave <a href="https://www.atechpcb.com/microwave-rf-pcb" rel="noopener noreferrer" target="_blank">RF PCB</a> should choose copper foil no larger than 18μm. If you choose 35μm copper foil, high image accuracy will make manufacturing-ability worse, and the yield will be reduced accordingly.</p><p><br></p><p>Research shows that the type of copper foil also affects image accuracy. There are currently two types of copper foil, namely rolled copper foil and electrolytic copper foil. Compared with electrolytic copper foil, rolled copper foil is more suitable for making high-precision images, so it is imperative to choose rolled copper foil laminate.</p><p><br></p><p><strong>Environmental adaptation</strong></p><p><br></p><p>The existing microwave<a href="https://www.atechpcb.com/microwave-rf-pcb" rel="noopener noreferrer" target="_blank"> RF PCB</a> laminate can meet the standard requirements of the temperature range of -55 ℃ ~ + 125 ℃ without any problem. However, we should also consider two points: First, whether through-hole or non-copper plating will affect the choice of laminates. For microwave RF PCBs with plated through-holes, the greater the thermal expansion coefficient of the laminate in the Z axis, the possibility of plating The higher. The through hole cracks under the influence of high and low temperatures. Therefore, on the premise of satisfying the dielectric properties, a laminate with a small thermal expansion coefficient on the Z axis should be selected.</p><p><br></p><p>The second is the influence of humidity on the selection of <strong>microwave RF PCB</strong> laminates. The resin absorption rate of the basic laminate itself is very low, but after adding reinforcing materials, its overall water absorption rate will increase significantly, and it will also affect the dielectric if it is in high humidity. For use in environments, laminates with low water absorption should be selected.</p>
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