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<p>How to choose various types of <span style="color: rgb(34, 34, 34);"><a href="https://www.lepuseal.com/products-1" target="_blank">Mechanical Seal</a>s</span></p><p><br></p><p>1 Epoxy modified one-component product 1 Density varies from 1.1 to 2.8, curing time is 50 degrees/4 hours or 110 degrees/30 minutes or 110 degrees/50 minutes;</p><p><br></p><p>2 With moderate thixotropy, the electronic components can be covered and wrapped by covering on the circuit board, and the glue can be leveled by itself, but it does not flow, nor does it flow during the baking and curing process, maintaining the original shape;</p><p><br></p><p>3 The cured material is black or amber bright, has strong adhesion to circuit boards and electronic components, and can withstand high temperature of 200-300 ℃ and strong acid desulfurization pump <a href="https://www.lepuseal.com/products-1" rel="noopener noreferrer" target="_blank">mechanical seal</a> alkali corrosion and corrosion resistance of various solvents;</p><p><br></p><p>4 Higher bonding strength, better heat resistance, bonding force can reach device damage, temperature resistance can also reach device damage, the cured product is not corroded by professional solvents, and the circuit and electronic components can be favorably protected to prevent The internal technology of the device is leaked;</p><p><br></p><p>5 This product is suitable for confidential potting of electronic devices. After curing, it has strong solvent resistance of agitated mechanical seal, and can withstand long-term immersion in organic solvents; it has a very high thermal deformation temperature and can resist high temperature damage; at the same time, it has a good Hardness and wear resistance, can resist the etching damage of general cutting tools.</p><p><br></p><p>6 Use this product to potting electronic circuits, which has excellent anti-decryption performance.</p><p><br></p><p>7 This product is easy to use, long storage period, high bonding strength, fast curing speed, low shrinkage, non-toxic and harmless, etc.</p><p><br></p><p>8 Store at room temperature for 70 days, and store in refrigerator for more than half a year. Diepoxy modified two-component product is a two-component heat-curing potting material, which becomes a dense solid structure after curing, with high hardness, good heat resistance, extremely difficult to disassemble, and can be protected , Waterproof and confidential.</p>
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